Are you looking quote for part TC5564APL-15? The Toshiba International Corporation-manufactured component (CAGE Code: 61802) is documented under NSN 5962-01-310-2181 as Microcircuit Memory. For the fastest quote, please complete our RFQ form with details about TC5564APL-15. We guarantee a response within 15 minutes.
ASAP Components provides the verified TC5564APL-15, classified under INC 41015, FSG 59 Electrical and Electronic Equipment Components, FSC 5962 Microcircuits Electronic, NIIN 01-310-2181, and NCB 01. Submit your requirements today to receive immediate pricing and availability information.
| NSN | FSC | NIIN | CLS | Hazmat | DEMIL | Cancelled NSN |
|---|---|---|---|---|---|---|
| 5962-01-310-2181 Item PartTypeName: MICROCIRCUIT,MEMORY | 5962 | 013102181 | N | B | ||
| CIIC | HCC | ESD | PMIC | Criticality | ENAC | |
| B | A | 0 | ||||
| Part Number | ISC | RNVC | RNCC | HCC | MSDS | SADC |
| TC5564APL-15 | 5 | 2 | 3 |
| MRC | Criteria | Characteristic |
|---|---|---|
| ADAQ | BODY LENGTH | 380.0 MILLIMETERS MAXIMUM |
| ADAT | BODY WIDTH | 142.0 MILLIMETERS MAXIMUM |
| ADAU | BODY HEIGHT | 469.0 MILLIMETERS MAXIMUM |
| CQSJ | INCLOSURE MATERIAL | CERAMIC |
| AFGA | OPERATING TEMP RANGE | -40.0 TO 85.0 DEG CELSIUS |
| AFJQ | STORAGE TEMP RANGE | -55.0 TO 150.0 DEG CELSIUS |
| CBBL | FEATURES PROVIDED | BURN IN AND LOW POWER AND STATIC OPERATION |
| CQWX | OUTPUT LOGIC FORM | COMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC |
| CRHL | BIT QUANTITY | 65536 |
| CSWJ | WORD QUANTITY | 8192 |
| CZEN | VOLTAGE RATING AND TYPE PER CHARACTERISTIC | -0.3 VOLTS MINIMUM POWER SOURCE AND 7.0 VOLTS MAXIMUM POWER SOURCE |
| CQSZ | INCLOSURE CONFIGURATION | DUAL-IN-LINE |
| CZER | MEMORY DEVICE TYPE | ROM |
| TTQY | TERMINAL TYPE AND QUANTITY | 28 PRINTED CIRCUIT |
| CQZP | INPUT CIRCUIT PATTERN | 26 INPUT |
| CWSG | TERMINAL SURFACE TREATMENT | SOLDER |
| End Use : 21320 | Semiconductors |
|---|---|
| Schedule B : 8542900000 (NAICS 334413) | Electronic integrated circuits and microassembly parts |
| SITC : 77689 | Parts of electronic integrated circuits and microassembles |
| ADPE | Represents items with no adp components |
|---|---|
| CRITL | The item does not have a nuclear hardened feature or any other critical feature such as tolerance, fit restriction or application. |
| ESD | B - Represents items with esd sensitivity. |
| HMIC | N - Indicates there is no data in the hmirs and the nsn is in a fsc not generally suspected of containing hazardous materials. |
| PMIC | A - Item does not contain precious metal. |
| ACC: | H - Instruments/equipment/supplies for radio, communications, electrical, laboratory, etc. (includes signal corps) |
|---|---|
| ADC: | A - Shipment is not a consolidation and does not exceed 84 inches in any dimension. |
| LTL: | W - Rating variable |
| NMFC: | 061700 - Elec appliances/instruments noi |
| SHC: | 9 - Other or no special handling required (sh) |
| TCC: | 3 - Electrostatic sensitive device (esd) |
| WCC: | 72D - Communications/electronics, other than sigint/ew or comsec repair parts and components |
