Are you looking quote for part DP05072-000? The Sdi Inc-manufactured component (CAGE Code: 54558) is documented under NSN 5961-01-350-1245 as Semiconductor Devic. For the fastest quote, please complete our RFQ form with details about DP05072-000. We guarantee a response within 15 minutes.
ASAP Components provides the verified DP05072-000, classified under INC 20589, FSG 59 Electrical and Electronic Equipment Components, FSC 5961 Semiconductor Devices and Associated Hardware, NIIN 01-350-1245, and NCB 01. Submit your requirements today to receive immediate pricing and availability information.
| NSN | FSC | NIIN | CLS | Hazmat | DEMIL | Cancelled NSN |
|---|---|---|---|---|---|---|
| 5961-01-350-1245 Item PartTypeName: SEMICONDUCTOR DEVICE,DIODE | 5961 | 013501245 | 0 | N | ||
| CIIC | HCC | ESD | PMIC | Criticality | ENAC | |
| U | G | |||||
| Part Number | ISC | RNVC | RNCC | HCC | MSDS | SADC |
| 61205-90066 | 5 | 2 | 3 |
| MRC | Criteria | Characteristic |
|---|---|---|
| CTQX | CURRENT RATING PER CHARACTERISTIC | 10.00 MICROAMPERES MAXIMUM REVERSE CURRENT,DC |
| FEAT | SPECIAL FEATURES | THE DIODE SHALL BE CAPABLE OF FULFILLING ALL REQUIREMENTS WHEN ATTACHED TO A GOLD PLATED ALUMINUM GROUND PLANE USING A CONDUCTIVE SILVER FILLED EPOXY; JUNCTION PATTERN ARRANGEMENT: PN |
| ABKW | OVERALL HEIGHT | 0.005 INCHES MINIMUM AND 0.008 INCHES MAXIMUM |
| AXGY | MOUNTING METHOD | PRESS FIT |
| CBBL | FEATURES PROVIDED | MOUNTING PAD |
| CTQN | VOLTAGE RATING IN VOLTS PER CHARACTERISTIC | 100.0 MINIMUM BREAKDOWN VOLTAGE,DC |
| CTRD | POWER RATING PER CHARACTERISTIC | 200.0 MILLIWATTS MAXIMUM COLLECTOR POWER DISSIPATION |
| CTRG | CAPACITANCE RATING IN PICOFARADS | 0.1 MAXIMUM |
| AFZC | FUNCTION FOR WHICH DESIGNED | SWITCHING |
| CTSG | MAXIMUM OPERATING TEMP PER MEASUREMENT POINT | 85.0 DEG CELSIUS AMBIENT AIR |
| PMLC | PRECIOUS MATERIAL AND LOCATION | TERMINAL SURFACES GOLD |
| PRMT | PRECIOUS MATERIAL | GOLD |
| ABHP | OVERALL LENGTH | 0.016 INCHES NOMINAL |
| ABMK | OVERALL WIDTH | 0.016 INCHES NOMINAL |
| MATT | MATERIAL | SILICON SEMICONDUCTOR |
| TTQY | TERMINAL TYPE AND QUANTITY | 1 BONDING PAD |
| End Use : 21320 | Semiconductors |
|---|---|
| Schedule B : 8541100070 (NAICS 334413) | Diodes, other than photosensitve or led, with a current of 0.5 a or less |
| SITC : 77631 | Diodes, not photosensitive nor light emitting diodes |
| CRITL | The item does not have a nuclear hardened feature or any other critical feature such as tolerance, fit restriction or application. |
|---|---|
| HMIC | N - Indicates there is no data in the hmirs and the nsn is in a fsc not generally suspected of containing hazardous materials. |
| PMIC | G - Item contains gold. |
| AAC | Z |
|---|---|
| Classification Control | U |
| MGMT_CTL | 9b----- |
| Quantity per pack | 1 |
| Repariability | |
| Shelf Life | N/A |
| SOS | Sms |
| Unit of Measure | Ea |
| ACC: | H - Instruments/equipment/supplies for radio, communications, electrical, laboratory, etc. (includes signal corps) |
|---|---|
| ADC: | A - Shipment is not a consolidation and does not exceed 84 inches in any dimension. |
| LTL: | W - Rating variable |
| NMFC: | 063025 - Semiconductors/devices noi etc |
| SHC: | 9 - Other or no special handling required (sh) |
| TCC: | Z - No special type of cargo code applicable |
| WCC: | 72D - Communications/electronics, other than sigint/ew or comsec repair parts and components |
