Are you looking quote for part 401-39771-06? The Raytheon Company Dba Raytheon Div Hris Corp-manufactured component (CAGE Code: 97871) is documented under NSN 5962-01-243-6441 as Microcircuit Memory. For the fastest quote, please complete our RFQ form with details about 401-39771-06. We guarantee a response within 15 minutes.
ASAP Components provides the verified 401-39771-06, classified under INC 41015, FSG 59 Electrical and Electronic Equipment Components, FSC 5962 Microcircuits Electronic, NIIN 01-243-6441, and NCB 01. Submit your requirements today to receive immediate pricing and availability information.
| NSN | FSC | NIIN | CLS | Hazmat | DEMIL | Cancelled NSN |
|---|---|---|---|---|---|---|
| 5962-01-243-6441 Item Description: MICROCIRCUIT,MEMORY | 5962 | 012436441 | N | |||
| CIIC | HCC | ESD | PMIC | Criticality | ENAC | |
| Part Number | ISC | RNVC | RNCC | HCC | MSDS | SADC |
| 401-39771-06 | 5 | 2 | 3 |
| MRC | Criteria | Characteristic |
|---|---|---|
| CBBL | FEATURES PROVIDED | MONOLITHIC AND ULTRAVIOLET ERASABLE AND PROGRAMMABLE |
| CRHL | (NON-CORE DATA) BIT QUANTITY | 32768 |
| ADAQ | BODY LENGTH | 1.285 INCHES MAXIMUM |
| ADAT | BODY WIDTH | 0.600 INCHES MAXIMUM |
| AFGA | OPERATING TEMP RANGE | -55.0/+125.0 DEG CELSIUS |
| TTQY | TERMINAL TYPE AND QUANTITY | 24 PRINTED CIRCUIT |
| CQSJ | INCLOSURE MATERIAL | CERAMIC |
| CQWX | OUTPUT LOGIC FORM | METAL OXIDE-SEMICONDUCTOR LOGIC |
| CWSG | TERMINAL SURFACE TREATMENT | SOLDER |
| ADAU | BODY HEIGHT | 0.180 INCHES NOMINAL |
| AFJQ | STORAGE TEMP RANGE | -65.0 TO 150.0 DEG CELSIUS |
| CZER | MEMORY DEVICE TYPE | ROM |
| CZEN | VOLTAGE RATING AND TYPE PER CHARACTERISTIC | 5.5 VOLTS MAXIMUM POWER SOURCE |
| CQSZ | INCLOSURE CONFIGURATION | DUAL-IN-LINE |
| CSWJ | (NON-CORE DATA) WORD QUANTITY | 4096 |
| CQZP | INPUT CIRCUIT PATTERN | 14 INPUT |
| End Use : 21320 | Semiconductors |
|---|---|
| Schedule B : 8542900000 (NAICS 334413) | Electronic integrated circuits and microassembly parts |
| SITC : 77689 | Parts of electronic integrated circuits and microassembles |
| ADPE | Represents items with no adp components |
|---|---|
| CRITL | The item does not have a nuclear hardened feature or any other critical feature such as tolerance, fit restriction or application. |
| ESD | B - Represents items with esd sensitivity. |
| HMIC | N - Indicates there is no data in the hmirs and the nsn is in a fsc not generally suspected of containing hazardous materials. |
| PMIC | A - Item does not contain precious metal. |
