Are you looking quote for part IM6312AMD? The Intersil Corporation-manufactured component (CAGE Code: 32293) is documented under NSN 5962-01-109-7819 as Microcircuit Memory. For the fastest quote, please complete our RFQ form with details about IM6312AMD. We guarantee a response within 15 minutes.
ASAP Components provides the verified IM6312AMD, classified under INC 41015, FSG 59 Electrical and Electronic Equipment Components, FSC 5962 Microcircuits Electronic, NIIN 01-109-7819, and NCB 01. Submit your requirements today to receive immediate pricing and availability information.
| NSN | FSC | NIIN | CLS | Hazmat | DEMIL | Cancelled NSN |
|---|---|---|---|---|---|---|
| 5962-01-109-7819 Item PartTypeName: MICROCIRCUIT,MEMORY | 5962 | 011097819 | 0 | N | B | |
| CIIC | HCC | ESD | PMIC | Criticality | ENAC | |
| U | B | A | 0 | |||
| Part Number | ISC | RNVC | RNCC | HCC | MSDS | SADC |
| HM1-6312A-8 | 5 | 9 | 5 |
| MRC | Criteria | Characteristic |
|---|---|---|
| ADAQ | BODY LENGTH | 0.880 INCHES MINIMUM AND 0.910 INCHES MAXIMUM |
| ADAT | BODY WIDTH | 0.290 INCHES MINIMUM AND 0.320 INCHES MAXIMUM |
| ADAU | BODY HEIGHT | 0.145 INCHES MINIMUM AND 0.175 INCHES MAXIMUM |
| AFGA | OPERATING TEMP RANGE | -55.0 TO 125.0 DEG CELSIUS |
| AFJQ | STORAGE TEMP RANGE | -65.0 TO 150.0 DEG CELSIUS |
| CBBL | FEATURES PROVIDED | HERMETICALLY SEALED AND HIGH SPEED AND LOW POWER AND W/ENABLE |
| CQSJ | INCLOSURE MATERIAL | CERAMIC |
| CQSZ | INCLOSURE CONFIGURATION | DUAL-IN-LINE |
| CQWX | OUTPUT LOGIC FORM | COMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC |
| CQZP | INPUT CIRCUIT PATTERN | 15 INPUT |
| CWSG | TERMINAL SURFACE TREATMENT | SOLDER |
| CZEN | VOLTAGE RATING AND TYPE PER CHARACTERISTIC | 12.3 VOLTS MAXIMUM POWER SOURCE |
| CZER | MEMORY DEVICE TYPE | ROM |
| CZZZ | MEMORY CAPACITY | UNKNOWN |
| TTQY | TERMINAL TYPE AND QUANTITY | 18 PRINTED CIRCUIT |
| End Use : 21320 | Semiconductors |
|---|---|
| Schedule B : 8542900000 (NAICS 334413) | Electronic integrated circuits and microassembly parts |
| SITC : 77689 | Parts of electronic integrated circuits and microassembles |
| ADPE | Represents items with no adp components |
|---|---|
| CRITL | The item does not have a nuclear hardened feature or any other critical feature such as tolerance, fit restriction or application. |
| ESD | B - Represents items with esd sensitivity. |
| HMIC | N - Indicates there is no data in the hmirs and the nsn is in a fsc not generally suspected of containing hazardous materials. |
| PMIC | A - Item does not contain precious metal. |
| AAC | V |
|---|---|
| Classification Control | U |
| MGMT_CTL | 1-b2--- |
| Quantity per pack | 1 |
| Repariability | This is a nonreparable item. if condemned or economically unserviceable, then dispose at the level authorized replace the item. |
| Shelf Life | N/A |
| SOS | Sms |
| Unit of Measure | Ea |
| ACC: | H - Instruments/equipment/supplies for radio, communications, electrical, laboratory, etc. (includes signal corps) |
|---|---|
| ADC: | A - Shipment is not a consolidation and does not exceed 84 inches in any dimension. |
| LCL: | P - 77.5 |
| LTL: | W - Rating variable |
| NMFC: | 061700 - Elec appliances/instruments noi |
| SHC: | 9 - Other or no special handling required (sh) |
| TCC: | Z - No special type of cargo code applicable |
| WCC: | 738 - Computing equipment, computer components, and circuit cards |
