Are you looking quote for part HMP112U6EFR8C-S6? The Hynix Semiconductor America-manufactured component (CAGE Code: 0N1B7) is documented under NSN 5998-01-577-6891 as Circuit Card Assemb. For the fastest quote, please complete our RFQ form with details about HMP112U6EFR8C-S6. We guarantee a response within 15 minutes.
ASAP Components provides the verified HMP112U6EFR8C-S6, classified under INC 61638, FSG 59 Electrical and Electronic Equipment Components, FSC 5998 Electrical and Electronic Assemblies Boards Cards and Associated Hardware, NIIN 01-577-6891, and NCB 01. Submit your requirements today to receive immediate pricing and availability information.
| NSN | FSC | NIIN | CLS | Hazmat | DEMIL | Cancelled NSN |
|---|---|---|---|---|---|---|
| 5998-01-577-6891 Item PartTypeName: CIRCUIT CARD ASSEMBLY | 5998 | 015776891 | 0 | N | D | |
| CIIC | HCC | ESD | PMIC | Criticality | ENAC | |
| U | D | A | 0 | |||
| Part Number | ISC | RNVC | RNCC | HCC | MSDS | SADC |
| 601F0049-51 | 5 | 1 | C | A |
| MRC | Criteria | Characteristic |
|---|---|---|
| AGAV | END ITEM IDENTIFICATION | DALR |
| CXCY | PART NAME ASSIGNED BY CONTROLLING AGENCY | DDR2 MEMORY MODULE |
| End Use : 21320 | Semiconductors |
|---|---|
| Schedule B : 8542900000 (NAICS 334413) | Electronic integrated circuits and microassembly parts |
| SITC : 77689 | Parts of electronic integrated circuits and microassembles |
| ADPE | Represents items with no adp components |
|---|---|
| CRITL | The item does not have a nuclear hardened feature or any other critical feature such as tolerance, fit restriction or application. |
| ESD | D - Represents items with both esd and emi sensitivity. |
| HMIC | N - Indicates there is no data in the hmirs and the nsn is in a fsc not generally suspected of containing hazardous materials. |
| PMIC | A - Item does not contain precious metal. |
| AAC | G |
|---|---|
| Classification Control | U |
| MGMT_CTL | Sf9---n |
| Quantity per pack | 1 |
| Repariability | |
| Shelf Life | N/A |
| SOS | G69 |
| Unit of Measure | Ea |
