Are you looking quote for part DPS 1X16-RB? The Dpac Technologies Corp-manufactured component (CAGE Code: 66847) is documented under NSN 5962-01-356-6553 as Microcircuit Assemb. For the fastest quote, please complete our RFQ form with details about DPS 1X16-RB. We guarantee a response within 15 minutes.
ASAP Components provides the verified DPS 1X16-RB, classified under INC 33695, FSG 59 Electrical and Electronic Equipment Components, FSC 5962 Microcircuits Electronic, NIIN 01-356-6553, and NCB 01. Submit your requirements today to receive immediate pricing and availability information.
| NSN | FSC | NIIN | CLS | Hazmat | DEMIL | Cancelled NSN |
|---|---|---|---|---|---|---|
| 5962-01-356-6553 Item PartTypeName: MICROCIRCUIT ASSEMBLY | 5962 | 013566553 | 0 | N | B | |
| CIIC | HCC | ESD | PMIC | Criticality | ENAC | |
| 7 | B | A | 0 | |||
| Part Number | ISC | RNVC | RNCC | HCC | MSDS | SADC |
| 205-0059-001 | 5 | 2 | 3 |
| MRC | Criteria | Characteristic |
|---|---|---|
| ADAQ | BODY LENGTH | 0.999 INCHES NOMINAL |
| ADAT | BODY WIDTH | 0.999 INCHES NOMINAL |
| AFGA | OPERATING TEMP RANGE | -55.0 TO 125.0 DEG CELSIUS |
| CBBL | FEATURES PROVIDED | HERMETICALLY SEALED AND BURN IN AND RADIATION HARDENED AND STATIC OPERATION |
| CQWX | OUTPUT LOGIC FORM | COMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC |
| CZEM | MICROCIRCUIT DEVICE TYPE AND QUANTITY | 4 MEMORY |
| CZER | MEMORY DEVICE TYPE | RAM |
| ADAU | BODY HEIGHT | 0.170 INCHES NOMINAL |
| CQSJ | INCLOSURE MATERIAL | CERAMIC |
| CWSG | TERMINAL SURFACE TREATMENT | SOLDER |
| TEST | TEST DATA DOCUMENT | 96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS,INDIVIDUAL MANUFACTUREER STANDARDS,ETC.). |
| FEAT | SPECIAL FEATURES | NUCLEAR HARDNESS CRITICAL ITEMS |
| NHCF | NUCLEAR HARDNESS CRITICAL FEATURE | HARDENED |
| TTQY | TERMINAL TYPE AND QUANTITY | 31 PIN |
| End Use : 21320 | Semiconductors |
|---|---|
| Schedule B : 8542900000 (NAICS 334413) | Electronic integrated circuits and microassembly parts |
| SITC : 77689 | Parts of electronic integrated circuits and microassembles |
| ADPE | Represents items with no adp components |
|---|---|
| CRITL | The item is specifically designed to be or selected as being nuclear hard (i.E., it will continue to perform its designed function in an environment created by a nuclear explosion). the item does not have other critical features. |
| ESD | B - Represents items with esd sensitivity. |
| HMIC | N - Indicates there is no data in the hmirs and the nsn is in a fsc not generally suspected of containing hazardous materials. |
| PMIC | A - Item does not contain precious metal. |
| AAC | J |
|---|---|
| Classification Control | U |
| MGMT_CTL | ------- |
| Quantity per pack | No qup |
| Repariability | |
| Shelf Life | N/A |
| SOS | F59 |
| Unit of Measure | Ea |
| ACC: | H - Instruments/equipment/supplies for radio, communications, electrical, laboratory, etc. (includes signal corps) |
|---|---|
| ADC: | A - Shipment is not a consolidation and does not exceed 84 inches in any dimension. |
| LTL: | P - 77.5 |
| NMFC: | 061300 - Circuit breaker/switch noi |
| SHC: | 9 - Other or no special handling required (sh) |
| TCC: | 3 - Electrostatic sensitive device (esd) |
| WCC: | 72D - Communications/electronics, other than sigint/ew or comsec repair parts and components |
