Are you looking quote for part CY7C263-45DMB? The Cypress Semiconductor Inc-manufactured component (CAGE Code: 65786) is documented under NSN 5962-01-375-2538 as Microcircuit Memory. For the fastest quote, please complete our RFQ form with details about CY7C263-45DMB. We guarantee a response within 15 minutes.
ASAP Components provides the verified CY7C263-45DMB, classified under INC 41015, FSG 59 Electrical and Electronic Equipment Components, FSC 5962 Microcircuits Electronic, NIIN 01-375-2538, and NCB 01. Submit your requirements today to receive immediate pricing and availability information.
| NSN | FSC | NIIN | CLS | Hazmat | DEMIL | Cancelled NSN |
|---|---|---|---|---|---|---|
| 5962-01-375-2538 Item PartTypeName: MICROCIRCUIT,MEMORY | 5962 | 013752538 | 0 | N | B | |
| CIIC | HCC | ESD | PMIC | Criticality | ENAC | |
| U | B | A | 0 | |||
| Part Number | ISC | RNVC | RNCC | HCC | MSDS | SADC |
| 654907-6 | 5 | 2 | 3 |
| MRC | Criteria | Characteristic |
|---|---|---|
| ADAQ | BODY LENGTH | 1.230 INCHES MINIMUM AND 1.280 INCHES MAXIMUM" |
| ADAT | BODY WIDTH | 0.245 INCHES MINIMUM AND 0.310 INCHES MAXIMUM" |
| ADAU | BODY HEIGHT | 0.095 INCHES MINIMUM AND 0.185 INCHES MAXIMUM" |
| AEHX | MAXIMUM POWER DISSIPATION RATING | 660.0 MILLIWATTS" |
| AFGA | OPERATING TEMP RANGE | -55.0 TO 125.0 DEG CELSIUS" |
| AFJQ | STORAGE TEMP RANGE | -65.0 TO 150.0 DEG CELSIUS" |
| CBBL | FEATURES PROVIDED | 3-STATE OUTPUT AND HIGH SPEED AND LOW POWER AND W/DISABLE AND HIGH PERFORMANCE AND ULTRAVIOLET ERASABLE AND HIGH IMPEDANCE" |
| CQSJ | INCLOSURE MATERIAL | CERAMIC" |
| CQSZ | INCLOSURE CONFIGURATION | DUAL-IN-LINE" |
| CQWX | OUTPUT LOGIC FORM | COMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC" |
| CQZP | INPUT CIRCUIT PATTERN | 14 INPUT" |
| CTQX | CURRENT RATING PER CHARACTERISTIC | 120.00 MILLIAMPERES MAXIMUM SUPPLY" |
| CWSG | TERMINAL SURFACE TREATMENT | SOLDER" |
| CZEN | VOLTAGE RATING AND TYPE PER CHARACTERISTIC | -0.5 VOLTS MINIMUM POWER SOURCE AND 7.0 VOLTS MAXIMUM POWER SOURCE" |
| CZEP | CAPITANCE RATING PER CHARACTERISTIC | 5.00 INPUT PICOFARADS MAXIMUM AND 8.00 OUTPUT PICOFARADS MAXIMUM" |
| CZEQ | TIME RATING PER CHACTERISTIC | 45.00 NANOSECONDS MAXIMUM ACCESS" |
| CZER | MEMORY DEVICE TYPE | EPROM" |
| TEST | TEST DATA DOCUMENT | 96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.)." |
| TTQY | TERMINAL TYPE AND QUANTITY | 24 PRINTED CIRCUIT" |
| ADAQ | BODY LENGTH | 1.230 INCHES MINIMUM AND 1.280 INCHES MAXIMUM" |
| ADAT | BODY WIDTH | 0.245 INCHES MINIMUM AND 0.310 INCHES MAXIMUM" |
| ADAU | BODY HEIGHT | 0.095 INCHES MINIMUM AND 0.185 INCHES MAXIMUM" |
| AEHX | MAXIMUM POWER DISSIPATION RATING | 660.0 MILLIWATTS" |
| AFGA | OPERATING TEMP RANGE | -55.0 TO 125.0 DEG CELSIUS" |
| AFJQ | STORAGE TEMP RANGE | -65.0 TO 150.0 DEG CELSIUS" |
| CBBL | FEATURES PROVIDED | 3-STATE OUTPUT AND HIGH SPEED AND LOW POWER AND W/DISABLE AND HIGH PERFORMANCE AND ULTRAVIOLET ERASABLE AND HIGH IMPEDANCE" |
| CQSJ | INCLOSURE MATERIAL | CERAMIC" |
| CQSZ | INCLOSURE CONFIGURATION | DUAL-IN-LINE" |
| CQWX | OUTPUT LOGIC FORM | COMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC" |
| CQZP | INPUT CIRCUIT PATTERN | 14 INPUT" |
| CTQX | CURRENT RATING PER CHARACTERISTIC | 120.00 MILLIAMPERES MAXIMUM SUPPLY" |
| CWSG | TERMINAL SURFACE TREATMENT | SOLDER" |
| CZEN | VOLTAGE RATING AND TYPE PER CHARACTERISTIC | -0.5 VOLTS MINIMUM POWER SOURCE AND 7.0 VOLTS MAXIMUM POWER SOURCE" |
| CZEP | CAPITANCE RATING PER CHARACTERISTIC | 5.00 INPUT PICOFARADS MAXIMUM AND 8.00 OUTPUT PICOFARADS MAXIMUM" |
| CZEQ | TIME RATING PER CHACTERISTIC | 45.00 NANOSECONDS MAXIMUM ACCESS" |
| CZER | MEMORY DEVICE TYPE | EPROM" |
| TEST | TEST DATA DOCUMENT | 96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.)." |
| TTQY | TERMINAL TYPE AND QUANTITY | 24 PRINTED CIRCUIT" |
| End Use : 21320 | Semiconductors |
|---|---|
| Schedule B : 8542900000 (NAICS 334413) | Electronic integrated circuits and microassembly parts |
| SITC : 77689 | Parts of electronic integrated circuits and microassembles |
| ADPE | Represents items with no adp components |
|---|---|
| CRITL | The item does not have a nuclear hardened feature or any other critical feature such as tolerance, fit restriction or application. |
| ESD | B - Represents items with esd sensitivity. |
| HMIC | N - Indicates there is no data in the hmirs and the nsn is in a fsc not generally suspected of containing hazardous materials. |
| PMIC | A - Item does not contain precious metal. |
