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| Item Name | Semiconductor Devic |
| INC Code | 20589 |
| Federal Supply Group (FSG) | Electrical and Electronic Equipment Components |
| Federal Supply Class (FSC) | 5961 Semiconductor Devices and Associated Hardware |
| National Item Identification Number (NIIN) | 01-351-4855 (013514855) |
| NCB Code | USA (01) |
| Part Number | Manufacturer | Item Name | QTY | RFQ |
|---|---|---|---|---|
| MMD-837-C11 | aeroflex limited | semiconductor devic | Avl | RFQ |
| MRC | Criteria | Characteristic |
|---|---|---|
| ABMK | OVERALL WIDTH | 0.38 MILLIMETERS NOMINAL |
| AFZC | FUNCTION FOR WHICH DESIGNED | FREQUENCY MULTIPLIER |
| CTQN | VOLTAGE RATING IN VOLTS PER CHARACTERISTIC | 20.0 MINIMUM BREAKDOWN VOLTAGE,DC |
| CTSG | MAXIMUM OPERATING TEMP PER MEASUREMENT POINT | 150.0 DEG CELSIUS AMBIENT AIR |
| PMLC | PRECIOUS MATERIAL AND LOCATION | TERMINALS GOLD |
| AXGY | MOUNTING METHOD | PRESS FIT |
| CTQX | CURRENT RATING PER CHARACTERISTIC | 10.00 MICROAMPERES MINIMUM AVERAGE FORWARD CURRENT AVERAGED OVER A FULL 60-HZ CYCLE |
| CTRD | POWER RATING PER CHARACTERISTIC | 100.0 MILLIWATTS MAXIMUM TOTAL POWER DISSIPATION |
| MATT | MATERIAL | SILICON SEMICONDUCTOR |
| PRMT | PRECIOUS MATERIAL | GOLD |
| TTQY | TERMINAL TYPE AND QUANTITY | 1 BONDING PAD |
| ABHP | OVERALL LENGTH | 0.38 MILLIMETERS NOMINAL |
| CTRG | CAPACITANCE RATING IN PICOFARADS | 0.4 MAXIMUM |
| ABKW | OVERALL HEIGHT | 0.13 MILLIMETERS NOMINAL |
| Relevant Components for NSN - 5961-01-351-4855, 5961013514855 | ||||
| 5935-01-278-3059 (5935012783059) | 5905-01-256-1503 (5905012561503) | 5935-01-525-7175 (5935015257175) | 5999-01-504-0324 (5999015040324) | |
| 5965-01-684-1554 (5965016841554) | 5962-01-435-1333 (5962014351333) | 5925-00-103-5151 (5925001035151) | 5945-00-333-1053 (5945003331053) | |
| 5995-01-117-0077 (5995011170077) | 5950-01-127-7165 (5950011277165) | 5925-00-449-3777 (5925004493777) | 5930-01-299-2711 (5930012992711) | |
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Guaranteed on-time |
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Customized and |
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Over 5100 |
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Complete Purchasing |
