Are you looking for board level component part number H2F1 18BK25, manufactured by Techflex? having description 2:1 Fab Heatshrink Blk 30Mm 25 2 To 1 25.0 (7.62M) 0.59"" (15.0Mm) 1.18"" (30.0Mm) - Black If so, please fill out the form below and you will receive a response from a seasoned customer service executive within 15 minutes.
ASAP-Components.com, an ASAP Semiconductor owned and operated company, is a leading distributor of Techflex obsolete electronic components, including board level components of part number H2F1 18BK25. We regularly serve clients across the globe with a commitment to short lead times, quality, competitive prices, and a strict adherence to US export laws.
Get a quick quote for part number H2F1 18BK25. To receive more information, you can also call us on our toll-free number +1-714-705-4780 any time of day, we are available 24/7, 365 days a year. You can also email us at sales@asap-components.com to expedite the purchase.
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